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Modeling spots on composite copper-chromium contacts of vacuum arcs and their stability

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Abstract(s)

Cathode spots on copper–chromium contacts of vacuum interrupters are simulated by means of a self-consistent space-resolved numerical model of cathode spots in vacuum arcs developed on the basis of the COMSOL Multiphysics software. Attention is focused on spots attached to Cr grains in the Cu matrix in a wide range of values of the ratio of the grain radius to the radius of the spot. In the case where this ratio is close to unity, parameters of spot are strongly different from those operating on both pure-copper and pure-chromium cathodes; in particular, the spot is maintained by Joule heat generation in the cathode body and the net energy flux is directed from the cathode to the plasma and not the other way round. An investigation of stability has shown that stationary spots are stable if current controlled. However, under conditions of high power circuit breakers, where the near-cathode voltage is not affected by ignition or extinction of separate spots, the spots are unstable and end up either in explosive-like behavior or in destruction by thermal conduction. On the other hand, spots live significantly longer-up to one order of magnitude-if the spot and grain sizes are close; else, typical spot lifetimes are of the order of 10 µs. This result is very interesting theoretically and may explain the changes in grain size occurring in the beginning of the lifetime of contacts of high-power current breakers. A sensitivity study has shown that variations in different aspects of the simulation model produce quantitative changes but do not affect the results qualitatively.

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Keywords

Cathode spot Grain size Spot extinction Spot lifetime Stability Vacuum circuit breaker Vacuum interrupter . Faculdade de Ciências Exatas e da Engenharia

Citation

Benilov, M. S., Cunha, M. D., Hartmann, W., Kosse, S., Lawall, A., & Wenzel, N. (2015). Modeling spots on composite copper-chromium contacts of vacuum arcs and their stability. IEEE Transactions on Plasma Science, 43(8), 2253-2260.

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Institute of Electrical and Electronics Engineers

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